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By speed
Medium speed bonder
High-speed bonder
Super high speed bonder
Features:40,000 pieces/h or more with rotary multi-head system.Assembleo-FCM type and FUJI-QP-132 type bonder are both equipped with 16 bonder heads, and their bonder speed reaches 96,000 pieces/h and 127,000 pieces/h respectively.
By function
High speed/Ultra high speed bonder
Features:Mainly with SMD components as the main body, not many varieties of SMD devices.
Multi-functional bonder
Features:Can mount large devices and shaped devices.
According to the way to divide
Sequential type bonder
Features:It is in accordance with the order of the components one by one paste to the PCB, usually see is the type of bonder.
Simultaneous type bonder
Features:It uses special hopper for placing cylindrical components, and one action can place all components on the corresponding pads of PCB. When the product is replaced, all the hoppers are replaced, which has been rarely used.
Simultaneous in-line type bonder
Features:Combined by multiple placement head, in turn and at the same time to a PCB placement, assembleon-FCM is this type.
Automation division
Fully automatic mechatronic bonder
Features:Most of the bonder is this type.
Manual type bonder
Features:Manual bonder head is installed in the Y-axis head, X, Y, e positioning can rely on manual movement and rotation to correct the position. It is mainly used for new product development and has the advantage of low price.
