Reflow Soldering

Back soldering, drying, heat preservation, shaping, fast cooling and other functions in one package

Can complete the CHIP, SOP, PLCC, QFP, BGA and all forms of packaging single and double-sided PCB board welding

Can be used as the product adhesive curing, circuit board heat aging, PCB board repair and many other jobs.

Widely used in various enterprises, companies, institutions R & D and small batch production needs.