Entry model 962 reflow soldering

I. Overview:

1. the product adopts microcomputer control, pre-stored eight kinds of back soldering temperature control curve for users to choose, can meet the national standard and American standard leaded and lead-free SMD, BGA welding requirements, simple operation, the whole welding process is completed automatically;.
2. Fast infrared radiation and circulating air heating make the temperature more accurate and uniform; fuzzy temperature control technology and visualization drawer type workbench make the whole welding process completed automatically under your supervision; it can complete the welding of single and double panels and can weld the finest surface-labeled components.

3. It adopts maintenance-free and high-reliability design, so that you can use it with satisfaction and peace of mind.
Second, the product description.

1. Large volume back to the welding area.
In the effective welding area up to: 180 x 235 mm, greatly increasing the use of the machine range, saving investment.

2. Multi-temperature curve selection.
Memory eight temperature parameters curve can be selected, and with manual heating, forced cooling function; the entire welding process automatically completed, easy to operate.

3. Unique design of temperature rise and temperature equalization.
Output power up to 800W fast infrared heating and temperature equalization fan with the temperature more accurate and uniform, can automatically and accurately complete the entire production process according to your preset temperature curve, without your hands.

4. Humanized technology boutique.
Rigid appearance, visual operation, friendly human-machine operation interface, perfect temperature curve scheme, reflecting the technology-based from beginning to end; light volume and weight, allowing you to save a lot of money, table-top placement mode, allowing you to have more space; simple operating instructions, so you will know at a glance.

5. Perfect function options.

Back soldering, drying, insulation, shaping, rapid cooling and other functions in one; can complete all package forms of CHIP, SOP, PLCC, QFP, BGA and other single- and double-sided PCB board welding; can be used as a product adhesive curing, circuit board heat aging, PCB board maintenance and many other jobs. Widely used in various enterprises, companies, institutions R & D and small batch production needs.